Articles

Dispensing any fluid material onto very small hybrids has two basic requirements: Applying the material to the exact location required and dispensing a dot of exact volume. Due to the small size of substrates and the typical density of required material pattern, these are not minor problems. Figure 1 illustrates a typical hybrid substrate wil […] Read More

The dispensing required for optoelectronic assembly is not too different from the dispensing for surface mount and solder paste applications. It just needs to be placed more accurately (volumetrically), and of course, with much smaller deposits than have ever been required before. No problem, if your dispensing system has the inherent capability for precision volumetric […] Read More

Matching Fluid Dispensers To Materials for Electronics Applications Understanding the technology behind popular non-contact dispensers for electronics assembly. There are four basic dispensing technologies being used today in Electronics Assembly. Although all the technologies can theoretically dispense almost all materials in most configurations (fills, beads, dots), each excels when used with certain materials (Fig. 1) […] Read More

The accurate transfer of fluid materials has been a human endeavor since the beginning of time. The caveman dipped a stick in his container of coloring and dabbed it on the cave walls. Surprisingly, that dispensing technique is still used today in the form of “pin transfer” — dipping a fine pin into an elaborate […] Read More

I was up late the other night and flipped to the classic movie channel as the movie "Field of Dreams" was playing. I hadn't seen it in a few years and decided to watch it again. In the movie, a voice keeps hounding Kevin Costner to take the ultimate risk of plowing his crop of […] Read More